Electroless plating technology for substrates
It is possible to electroplate the electrodes of a substrate with a cavity structure using independent pads!
Our company strives to minimize Ni corrosion (black pad) caused by replacement Au plating and provides a coating with bonding strength that satisfies our customers. Since it is an electroless plating process, it is possible to plate the electrodes of substrates with independent pads and cavity structures. We propose plating films for Ni and Au plating that are tailored to the environment in which the products will be used, such as solder joints and wire bonding. 【Features of Electroless Ni Plating Coating】 - Uniform plating film can be obtained without edge effects, unlike electroplating. - Excellent film thickness uniformity makes it suitable for products with complex shapes. - Can achieve greater hardness compared to electro Ni plating. - Superior corrosion and wear resistance. - Depending on the P concentration, it is also possible to impart non-magnetic or magnetic properties to the coating. *For more details, please refer to the PDF document or feel free to contact us.
- Company：清川メッキ工業
- Price：Other
